Release Notes

Release 1.0.1 - Mar 31, 2026

Yocto 5.0 (Scarthgap LTS) for dpp-lxx-8p boards

• Based on Compulab ucm-imx8m-plus release 4.1 github.com/compulab-yokneam/meta-bsp-imx8mp/releases/tag/ucm-imx8m-plus_r4.1

• Based on NXP release imx/scarthgap-6.6.52-2.2.0

• U-Boot 2023.04 based on NXP lf_v2023.04 and Compulab github.com/compulab-yokneam/u-boot-compulab/releases/tag/u-boot-compulab_v2023.04-imx8mp

• Kernel 6.6.52 based on NXP lf-6.6.y and Compulab github.com/compulab-yokneam/linux-compulab/releases/tag/linux-compulab_v6.6.52-imx8mp

Refer to the Software Classification Notice for further details.

Change Log

• Dependencies updated and pinned to Compulab ucm-imx8m-plus release 4.1

• U-Boot and Kernel changes merged from Compulab ucm-imx8m-plus release 4.1

• DRAM configuration of 2 GB and 4 GB modules separated (DRAM Configuration Table) due to restricted U-Boot SPL size according to Compulab

• Yocto Project setup scripts and instructions adapted

Release 1.0.0 - Mar 05, 2026

Yocto 5.0 (Scarthgap LTS) for dpp-lxx-8p boards

• Based on Compulab scarthgap github.com/compulab-yokneam/meta-bsp-imx8mp/tree/scarthgap

• Based on NXP release imx/scarthgap-6.6.52-2.2.0

• U-Boot 2023.04 based on NXP lf_v2023.04 and Compulab github.com/compulab-yokneam/u-boot-compulab/tree/u-boot-compulab_v2023.04

• Kernel 6.6.52 based on NXP lf-6.6.y and Compulab github.com/compulab-yokneam/linux-compulab/tree/linux-compulab_v6.6.52

Refer to the Software Classification Notice for further details.

Changes compared to Yocto 4.0 (Kirkstone LTS)

• meta-demmelproducts PRIORITY was raised from 11 to 13 due to included meta-flutter with PRIORITY 12

• custom splash screens are available now in bootloader, Linux kernel boot up, and PSplash. More information at demmel products Documentation Hub.

• The Wayland default display is moved to /run/wayland-0 (export WAYLAND_DISPLAY=/run/wayland-0)

• Audio TAS2563: the tas2563-digital-volume now range from 0 to 1024. The maximum value is 1024.

• device information now is available within the device tree

  • device name: /proc/device-tree/baseboard-name

  • device serial number: /proc/device-tree/baseboard-sn

• Instructions and documentations added and updated at demmel products Documentation Hub.

Releases 0.6.x

Yocto 4.0 (Kirkstone LTS) for dpp-lxx-8p boards

• Based on Compulab scarthgap github.com/compulab-yokneam/meta-bsp-imx8mp/tree/scarthgap

• Based on NXP release imx/imx-5.15.71-2.2.0

• U-Boot 2021.04 based on NXP lf_v2021.04 and Compulab github.com/compulab-yokneam/u-boot-compulab/tree/u-boot-compulab_v2021.04

• Kernel 5.15.71 based on NXP lf-5.15.y and Compulab github.com/compulab-yokneam/linux-compulab/tree/linux-compulab_v5.15.71

Refer to the Software Classification Notice for further details.

Software Classification Notice

Development / Reference Image – Not Production Ready

The BSP releases listed in this document are provided as development and reference images intended for evaluation, prototyping, and application development.

PLEASE NOTE: They are not production-qualified or security-hardened software releases.

The images therein may contain development features, debug configurations, default credentials, development keys, or other settings that are not suitable for deployment in commercial or industrial production systems.

THEREFORE: Before deploying a product in a production environment based on these BSP releases, the system integrator or product manufacturer MUST perform appropriate security hardening, system validation, and compliance verification.

Such activities typically include (but are not limited to) for example:

• Implementation and validation of a secure boot chain

• Replacement of development keys, certificates, and credentials

• Removal or restriction of debug and development interfaces

• Hardening of user authentication and access control mechanisms

• Implementation of a secure provisioning process

• Design and validation of a secure software update mechanism

• Vulnerability assessment and patch management processes

• Regulatory and industry compliance verification where applicable

The responsibility for production readiness, security validation, regulatory compliance, and lifecycle maintenance stays with the product manufacturer or system integrator, not with demmel products gmbh.

These BSP releases should not be deployed in security-critical, safety-critical, or field production systems without prior proper qualification and risk assessment.